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1. general description the SA56202 is a one-chip motor driver ic that is capable to drive all motors of cd or dvd systems: spindle, sled and loading motors and actuators on the optical pick-up unit. the driver intended for the 3-phase, brushless, hall-commutated spindle motor uses true-silent pwm. this proprietary technology ensures that all 3-phase motor currents are sinusoidal resulting in an optimally silent driver. internal regeneration of the back-emf of the spindle motor enables the driver to operate in current-steering mode without using external power-dissipating sense resistors. the driver intended for the 2-phase sled stepper motor operates in current-steering pwm mode. in addition the ic contains four full-bridge linear channels that can be used to drive a loading motor and 3d actuators (focus, tracking and tilt). the SA56202 is available in an exposed die pad htssop56 package. 2. features n true-silent pwm spindle motor driver n low heat generation due to power-ef?cient direct full-bridge switching of spindle motor driver n controlled spindle motor current during acceleration and brake n reverse torque brake function (full bridge) n adjustable spindle motor current limiter n internal regeneration for emf of spindle motor n current-steering pwm controlled stepper motor driver for sled n four class-ab linear channels for loading motor and 3d actuators (focus, tracking and tilt) n low on-resistance d-mosfet output power stages n built-in thermal shutdown, thermal warning and temperature diode n interfaces to 3 v and 5 v logic n package with low thermal resistance to heatsink (re?owable die pad). 3. applications n dvd+rw, dvd-rw, dvd-rom and dvd-ram n combi n cd-rom and cd-rw n other compact disk media. SA56202 one-chip motor driver rev. 01 19 july 2004 preliminary data sheet
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 2 of 24 philips semiconductors SA56202 one-chip motor driver 4. ordering information table 1: ordering information type number package name description version SA56202tw htssop56 plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad sot793-1
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 3 of 24 philips semiconductors SA56202 one-chip motor driver 5. block diagram fig 1. block diagram. 001aaa429 reverse detection level shift level shift level shift level shift sled logic current reference fg oscillator thermal shutdown fg hall bias adc charge pump mute/ standby functions spindle logic hall amp 1 2 3 4 5 6 7 8 9 10 11 12 13 15 14 16 17 18 28 19 20 21 22 23 24 25 26 27 diode 47 k w vinref vinref vinref vinref vinref vinref vinref SA56202 v ss(dio) vinld cosc hu + hu - hv + hv - hw + hw - hbias rref remf rlim v ss1(spn) u v dd1(spn) v v ss2(spn) w v dd2(spn) fg v ssd vinspn vinref v dda cp1 cp2 cp3 ctl1 ctl2 temp vinfcs vintrk vintlt v dd(ld) ldo + ldo - v ss(lin) v dd(act) tlto - trko - trko + fcso - fcso + tlto + rsld1 rsld2 sldo2 - sldo2 + sldo1 - sldo1 + v dd(sld) v ssa vinsld1 vinsld2 31 30 29 33 32 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 47 k w
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 4 of 24 philips semiconductors SA56202 one-chip motor driver 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration. SA56202tw 001aaa458 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 diode v ss(dio) vinld cosc hu + hu - hv + hv - hw + hw - hbias rref remf rlim v ss1(spn) u v dd1(spn) v v ss2(spn) w v dd2(spn) fg v ssd vinspn vinref v dda cp1 cp2 cp3 ctl1 ctl2 temp vinfcs vintrk vintlt v dd(ld) ldo + ldo - v ss(lin) v dd(act) tlto - trko - trko + fcso - fcso + tlto + rsld1 rsld2 sldo2 - sldo2 + sldo1 - sldo1 + v dd(sld) v ssa vinsld1 vinsld2 table 2: pin description symbol pin description hu+ 1 hall input u positive hu - 2 hall input u negative hv+ 3 hall input v positive hv - 4 hall input v negative hw+ 5 hall input w positive hw - 6 hall input w negative hbias 7 hall element bias rref 8 external resistor for current reference
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 5 of 24 philips semiconductors SA56202 one-chip motor driver remf 9 external resistor for emf regeneration rlim 10 external resistor for current limit v ss1(spn) 11 spindle driver ground 1 u 12 spindle driver output u v dd1(spn) 13 spindle driver supply voltage 1 v 14 spindle driver output v v ss2(spn) 15 spindle driver ground 2 w 16 spindle driver output w v dd2(spn) 17 spindle driver supply voltage 2 fg 18 frequency generator output v ssd 19 digital ground vinspn 20 spindle driver input voltage for spindle motor current vinref 21 reference input voltage for all motor drivers v dda 22 analog supply voltage cp1 23 charge pump capacitor connection 1 cp2 24 charge pump capacitor connection 2 cp3 25 charge pump capacitor connection 3 ctl1 26 driver logic control input 1 ctl2 27 driver logic control input 2 temp 28 thermal warning vinsld1 29 sled driver 1 input voltage for sled motor current vinsld2 30 sled driver 2 input voltage for sled motor current v ssa 31 analog ground v dd(sld) 32 sled driver supply voltage sld2o - 33 sled driver output 2 negative sldo2+ 34 sled driver output 2 positive rsld2 35 external sense resistor for sled driver 2 current sense sldo1 - 36 sled driver output 1 negative sldo1+ 37 sled driver output 1 positive rsld1 38 external sense resistor for sled driver 1 current sense tlto - 39 tilting driver output negative tlto+ 40 tilting driver output positive trko - 41 tracking driver output negative trko+ 42 tracking driver output positive v dd(act) 43 actuator drivers supply voltage v ss(lin) 44 linear drivers ground fcso - 45 focus driver output negative fcso+ 46 focus driver output positive ldo - 47 loading driver output negative ldo+ 48 loading driver output positive v dd(ld) 49 loading driver supply voltage table 2: pin description continued symbol pin description
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 6 of 24 philips semiconductors SA56202 one-chip motor driver 7. functional description 7.1 spindle motor control the control input voltage on pin vinspn is converted into a digital value by the adc where the voltage on pin vinref is the midpoint reference. the transconductance gain from input voltage v vinspn to output motor current i mot is: where i lim can be programmed by means of external resistor r lim ; see section 7.4 . the motor current is described by figure 3 . for vinspn voltages larger than v vinref the motor will accelerate with forward torque control. for vinspn voltages smaller than v vinref the motor will brake with reverse torque control. because the u, v and w half-bridges of the spindle motor driver use a direct pwm full-bridge switching scheme, the motor current can also be controlled and limited during brake. note that because of this active brake mechanism energy of the motor can be recuperated back to the supply. especially at large speeds, this can result in currents delivered back to the supply. if the supply and/or other circuits than the motor vintlt 50 tilting driver input for tilt actuator voltage vintrk 51 tracking driver input for tracking actuator voltage vinfcs 52 focus driver input for focus actuator voltage vinld 53 loading driver input for loading motor voltage v ss(dio) 54 temperature diode ground diode 55 diode for temperature readout cosc 56 external capacitor for internal oscillator table 2: pin description continued symbol pin description fig 3. spindle motor current as a function of control input voltage on pin vinspn. g m ( spn ) i mot v vinspn v vinref C ------------------------------------------------ - i lim v vinref --------------------- == 001aaa431 i lim i mot v vinspn - i lim reverse torque brake 0v vinref 2v vinref forward torque
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 7 of 24 philips semiconductors SA56202 one-chip motor driver driver do not use this recuperated current, than the supply voltage can possibly rise to unacceptable values. in that case it is recommended to lower the spindle current during brake by means of the vinspn setting. upon detection of reverse detection all u, v and w driver outputs are connected to v dd(spn) . this short brake prevents the motor of spinning backwards. 7.2 internal regeneration of back-emf spindle motor the spindle motor driver uses the information from the hall sensors to internally regenerate the back-emf of the motor. see figure 4 . rotational speed w is derived from the hall event frequency. multiplying w with the k-factor of the motor gives the back-emf voltage v emf . this v emf is added to the current-limit scaled spindle input voltage v vinspn . this sum v mot steers the pwm outputs u, v and w. the result is that the input voltage v vinspn sets the current through the motor. this explains how the SA56202 spindle motor driver exhibits a current control transfer function without using external sense resistors. the simpli?ed motor schematic in figure 5 shows the series resistance and back-emf voltage of the motor. fig 4. regeneration of back-emf voltage spindle motor. fig 5. simpli?ed spindle motor schematic. 001aaa438 pwm speed u v w hall u spindle motor v mot = v ri + v emf v ri = r m i m v emf = w k w hall v hall w digital domain vinspn torque control signal r lim maximum motor current r emf motor k-factor analog domain a d a d a d 001aaa450 v m1 v m2 v rm v rm v emf 2 v emf 2
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 8 of 24 philips semiconductors SA56202 one-chip motor driver figure 6 depicts the motor voltages v m1 and v m2 during accelerating and braking. the back-emf voltage is part of these motor voltages. 7.3 sine generation using true-silent signals for the phase relation between the hall inputs and the spindle outputs in forward rotation, see figure 7 . these are the signal shapes in sine mode using our true-silent pwm technology. the particular shape of the 120 symmetrical u, v and w steering voltages are because of improved drive strength and improved power ef?ciency. the drive strength is improved because with this signal shape a 15 % larger sine can be ?t within the supply rails compared to direct-written sine signals. also the power ef?ciency is improved because this signal shape has 33 % less switching losses compared to a direct-written sine. the result is that the motor currents (and motor torques) are pure sine waves generated in such a way that the motor is driven optimally silent, optimally power ef?cient and with maximum driving strength. fig 6. motor voltages when accelerating and braking with constant motor current. 001aaa432 v m2 accelerating braking v rm v rm v m1 v m1 v m2 v emf 2 v emf 2 v dd(spn) 2 v dd(spn) 0 0 w max ww 0 k
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 9 of 24 philips semiconductors SA56202 one-chip motor driver 7.4 programming r lim if the supply is connected between the terminals of a non-running spindle motor, then usually a current will ?ow that is too large. the motor current can be limited to a value i lim . this i lim can be programmed by means of r lim . in order to calculate the required r lim ?rst a typical maximum motor current i max needs to be determined: fig 7. phase relation between hall input signals and spindle motor driver output voltages u(v), v(v), w(v) and motor currents u(i), v(i), w(i) in forward rotation mode. 001aaa433 w v hall u u(v) u(i) v(v) v(i) w(v) w(i) hall w hall v u i max v dd spn () r motor r switches + ------------------------------------------- - =
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 10 of 24 philips semiconductors SA56202 one-chip motor driver i lim can be chosen to be a fraction of this maximum current i max . by making the ratio between r lim (connected to pin 10) and r ref (connected to pin 8) this same fraction, i lim is programmed as expressed in the following formula: so by choosing i lim , r lim needs to be: figure 8 shows the limit current as a function of r lim with r ref =47k w . during accelerating and braking the motor current will not exceed i lim . i lim also sets the transconductance gain i lim /v vinref of the spindle driver. 7.5 programming r emf the back-emf voltage is internally regenerated. the ratio between r emf and r ref is used to scale the internal emf regeneration. the value of external resistor r emf depends on the type of motor (k-factor and number of pole pairs n pp ) and the motor supply voltage v dd(spn) . the following formula should be used to determine the r emf resistor: with k in units nm/a. 7.6 fg generator the raw zero-crossings of the hall sensors are ?rst ?ltered and debounced before being passed to the fg generator. the fg generator toggles its output at every ?ltered hall zero-crossing. for three hall sensors this means that the motor frequency is linked to the fg frequency by: fig 8. limit current i lim as a function of external resistor r lim . i lim r lim r ref ------------ - i max = r lim i lim i max ------------ r ref = r lim (k w ) 050 40 20 30 10 001aaa434 40 60 20 80 100 0 i lim (% of i max ) r emf k 2.6 10 3 r ref n pp v dd spn () -------------------------------------------------- = f motor fg 3n pp ------------------- =
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 11 of 24 philips semiconductors SA56202 one-chip motor driver where n pp indicates the number of pole pairs of the motor. fg has an open-drain output for easy interfacing to 3 v and 5 v logic. 7.7 sled motor driver two current-steering pwm channels are available to drive a stepper motor. per channel an external sense resistor r sense is used that is connected to ground. a peak-current control loop is implemented that modulates the duty cycle of the pwm signal. see figure 9 . the clock generator has a nominal frequency of f osc /256 = 70 khz. see figure 10 for the transfer function from input voltage v vinsld to output current at a typical r sense of 0.5 w . input-to-output transconductance gain can be scaled down by connecting an external resistor r ext in series with the input vinsld. both limit current and transconductance gain are related to r sense in the following way: transconductance gain, limit current, fig 9. peak-current control architecture of stepper motor driver. fig 10. transfer function of stepper motor driver. s 001aaa435 m r s q clock 70 khz logic drive driver a vinsld r sense i o r ext 47 k w + - 47 k w v vinref input amplifier v vinref 001aaa436 v vinsld - v vinref (v) - 1 a + 1 a/v + 1 a/v 1 a i out (a) dead zone 30 mv - 30 mv i o v in ------- - 1 2r sense ----------------------- - = i lim 1v 2r sense ----------------------- - =
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 12 of 24 philips semiconductors SA56202 one-chip motor driver 7.8 loading motor driver one of the linear channels is available to drive a dc loading motor. pin v dd(ld) is used to set the supply voltage for the loading motor driver. figure 11 depicts the voltage-steering bridge topology of the SA56202. 7.9 actuator motor drivers three linear channels are available to drive 3d actuators: focus, tracking and tilt. a pin v dd(act) is used to set the supply voltage for these actuator drivers. the voltage-steering bridge topology is the same as depicted in figure 11 . the mismatch of the voltage gain of these 3 linear channels is guaranteed to be less than 5 %. 7.10 charge pump the on-board charge pump generates a regulated voltage of typically 18.2 v by using the v dd(spn) supply voltage. this boosted voltage is used to turn on the upper n-type dmos transistors of the output stages of the spindle driver, sled driver, loading driver and actuator drivers. recommended values for the pump-and-hold capacitor are 10 nf and 22 nf respectively (see also application diagram figure 13 ). the charge pump should not be loaded with other components or circuitry than these capacitors. 7.11 thermal protection if the junction temperature of the SA56202 exceeds 150 c, then a thermal warning signal is given at pin temp. temp has an active-low open-drain output for easy interfacing to 3 v and 5 v logic. the temperature hysteresis for the thermal warning is 10 c. if the junction temperature of the ic rises to 160 c, then a thermal shutdown is activated that sets all power outputs in 3-state. the temperature hysteresis for the thermal shutdown is 30 c. as soon as the thermal shutdown deactivates at 130 c, all motor drivers continue normal operation. fig 11. voltage-steering bridge topology of linear driver. 001aaa437 47 k w 47 k w 47 k w 47 k w 188 k w 188 k w r r ldo + ldo - v dd(ld) vinref vinld 188 k w 188 k w
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 13 of 24 philips semiconductors SA56202 one-chip motor driver 7.12 oscillator the rc oscillator uses two external components (r ref and c osc ) to ?x its frequency at 18 mhz. r ref is used to generate a reference current. this reference current is used to charge and discharge c osc . the nominal oscillation frequency f osc is 18 mhz with r ref =47k w (2 % tolerance) and c osc = 70 pf (5 % tolerance). these values are ?xed. the oscillator can be overruled by applying an 18 mhz clock to pin cosc. the reference current derived from r ref is also used for r lim and r emf . r ref should always be connected. 7.13 muting functions pins ctl1 and ctl2 are used to mute certain parts of the ic. see t ab le 3 . in this table off means 3-state. 8. limiting values table 3: muting functions ctl1 ctl2 loading motor sled motor others spindle mode l l off off off off l h on on off fg and hall bias on h l off on on block commutation h h off on on true-silent commutation table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit voltages v dd(spn) spindle driver supply voltage - 0.5 +16 v v dd(sld) sled driver supply voltage - 0.5 +16 v v dd(ld) loading driver supply voltage - 0.5 +16 v v dd(act) actuator drivers supply voltage - 0.5 +16 v v dda system supply voltage - 0.5 +6.5 v currents i dd(spn) current on pins 12, 14 and 16 - 2.1 a i dd(sld) current on pins 33, 34, 35, 36, 37 and 38 - 1.2 a i dd(act) current on pins 39, 40, 41, 42, 45, 46, 47 and 48 - 2.0 a i hall current on pins 1, 2, 3, 4, 5 and 6 - 1+1ma i hbias current on pin 7 - 1 +100 ma i rprog current on pins 8, 9 and 10 - 1+1ma i od current on pins 18 and 28 - 1 +10 ma i dig current on pins 26 and 27 - 1+1ma i cpump current on pins 23, 24 and 25 - 20 +20 ma
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 14 of 24 philips semiconductors SA56202 one-chip motor driver [1] class 1, equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor. [2] class 1, equivalent to discharging a 200 pf capacitor through a 0.75 m h coil and a 10 w resistor. 9. thermal characteristics i steer current on pins 20, 21, 29, 30, 50, 51, 52 and 28 - 1+1ma i diode current on pins 54 and 55 - 1+1ma i osc current on pin 56 - 20 +20 ma general t stg storage temperature - 55 +150 c t amb ambient temperature - 40 +85 c t j junction temperature - 40 +160 c electrostatic discharge voltage v esd(hbm) human body model pins 1 to 6 and 8 to 56 [1] - 1500 v pin 7 - 1000 v v esd(mm) machine model [2] - 150 v table 4: limiting values continued in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit table 5: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient multilayer pcb, no air?ow 33 k/w fig 12. maximum dissipation as a function of ambient temperature. 001aaa428 t amb ( c) 0 150 100 50 2 1 3 4 p d (w) 0
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 15 of 24 philips semiconductors SA56202 one-chip motor driver 10. characteristics table 6: characteristics t amb =25 c; v dda =5v; v dd(spn) =12v; v dd(sld) =12v; v dd(act) =5v; v dd(ld) = 12 v; unless otherwise speci?ed. symbol parameter conditions min typ max unit spindle motor driver v dda system supply voltage 4.5 5.0 5.5 v v dd(spn) motor supply voltage 4.5 12 14 v v io input offset voltage hall ampli?er - 3.5 - +3.5 mv v i input voltage range hall ampli?er 0 - v dda v v i(dif)(p-p) hall ampli?er differential input voltage (peak-to-peak value) 25--mv v hbias voltage on pin hbias i hbias = 32 ma - 0.6 0.9 v f osc oscillator frequency r ref =47k w ; c osc =70pf - 18 - mhz f pwm pwm frequency r ref =47k w ; c osc =70pf - 70 - khz r ds(on) d-mosfet on-resistance (high or low) - 0.35 0.50 w v vinref reference voltage on pin vinref 1.2 1.65 2.5 v v vinspn torque control voltage on pin vinspn 0- v dda v stepper motor driver v dda supply voltage 4.5 5.0 5.5 v v dd(sld) motor supply voltage 4.5 12 14 v i dd(sld) motor current limit r sense = 0.5 w 0.85 1.0 1.15 a f pwm pwm frequency r ref =47k w ; c osc =70pf - 70 - khz v i(trip) input dead-zone trip level 15 30 45 mv g m transconductance gain r sense = 0.5 w 0.85 1.0 1.15 a/v r ds(on) d-mosfet on-resistance (high or low) - 1.0 1.4 w loading motor driver v dd(ld) motor supply voltage 4.5 12 14 v i dd(ld) current limit (high or low) 0.9 1.2 2.0 a v oo output offset voltage - 100 0 +100 mv g v voltage gain 16.8 17.6 18.4 db r ds(on) d-mosfet on-resistance (high or low) - 0.6 0.9 w actuator driver (focus, tracking and tilt) v dd(act) supply voltage 4.5 5 14 v i dd(act) current limit (high or low) 0.9 1.2 2.0 a v oo output offset voltage - 55 0 +55 mv g v voltage gain 16.8 17.6 18.4 db g v(m) gain mismatch between 3 channels - - 5 %
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 16 of 24 philips semiconductors SA56202 one-chip motor driver r ds(on) d-mosfet on-resistance (high or low) - 0.6 0.9 w general v cp3 charge pump output voltage - 18.2 - v v ih high-level input voltage digital on pins 26 and 27 2.0 - - v v il low-level input voltage digital on pins 26 and 27 - - 0.8 v v ol low-level output voltage digital on pins 18 and 28 i ol = 2 ma - - 0.5 v i dda(q) v dda quiescent current ctl1 = h; ctl2 = h - 14 20 ma i dd(spn)(q) v dd(spn) quiescent current ctl1 = h; ctl2 = h - 9 15 ma i dd(sld)(q) v dd(sld) quiescent current ctl1 = h; ctl2 = h - 0 1 ma i dd(act)(q) v dd(act) quiescent current ctl1 = h; ctl2 = h - 16 25 ma i stb(tot) total standby current ctl1 = l; ctl2 = l - 4.5 8 ma t temp thermal warning temperature - 150 - c t hys(temp) thermal warning hysteresis - 10 - c t sd thermal shutdown temperature - 160 - c t hys(sd) thermal shutdown hysteresis - 30 - c table 6: characteristics continued t amb =25 c; v dda =5v; v dd(spn) =12v; v dd(sld) =12v; v dd(act) =5v; v dd(ld) = 12 v; unless otherwise speci?ed. symbol parameter conditions min typ max unit
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 17 of 24 philips semiconductors SA56202 one-chip motor driver 11. application information for r emf and r lim see section 7 . fig 13. application diagram. 001aaa430 m m reverse detection level shift level shift level shift level shift sled logic current reference fg oscillator thermal shutdown fg 0 v 12 v 12 v 0 v hall bias adc hall v hall u hall w charge pump mute/ standby functions mute/ select spindle logic hall amp 1 2 3 4 5 6 7 8 9 10 11 12 13 15 14 16 17 18 28 19 20 21 22 23 24 25 26 27 3.3 v 47 k w r emf r ref r lim 47 k w 3.3 v 22 nf 10 nf 5 v 1.65 v spindle input sled motor spindle motor 0 v 47 k w 47 k w vinref vinref vinref vinref vinref vinref vinref 5v 0v 150 w 31 30 29 33 32 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 0 v 0 v tray motor in focus in tracking in tilt in tray motor focus actuator 12 v 70 pf 12 v 0 v sled in2 sled in1 55 56 47 k w tracking actuator tilt actuator 0 v 5 v 0 v 0.5 w 0.5 w SA56202
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 18 of 24 philips semiconductors SA56202 one-chip motor driver 12. package outline fig 14. package outline. unit a max. a 1 a 2 a 3 b p ceh e ll p y w v q references outline version european projection issue date iec jedec jeita mm 1.2 0.15 0.05 1.05 0.80 0.25 0.27 0.17 0.20 0.09 4.3 4.1 0.5 8.3 7.9 0.4 0.1 8 0 o o 0.08 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.8 0.4 sot793-1 143e36t mo-153 03-03-04 d (1) 14.1 13.9 e (2) 6.2 6.0 e h d h z (1) 4.3 4.1 v m a e h d h h e d e c x q a l p detail x l (a 3 ) a 2 a 1 y exposed die pad pin 1 index b p w m htssop56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad sot793-1 e a z 1 56 28 29 0 2.5 5 mm scale
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 19 of 24 philips semiconductors SA56202 one-chip motor driver 13. soldering 13.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 13.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 20 of 24 philips semiconductors SA56202 one-chip motor driver C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 13.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 13.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 7: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 21 of 24 philips semiconductors SA56202 one-chip motor driver [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vsop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages.
9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 22 of 24 philips semiconductors SA56202 one-chip motor driver 14. revision history table 8: revision history document id release date data sheet status change notice order number supersedes SA56202_1 20040719 preliminary data sheet - 9397 750 12772 -
philips semiconductors SA56202 one-chip motor driver 9397 750 12772 ? koninklijke philips electronics n.v. 2004. all rights reserved. preliminary data sheet rev. 01 19 july 2004 23 of 24 15. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 16. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 17. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 18. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn).
? koninklijke philips electronics n.v. 2004 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 19 july 2004 document order number: 9397 750 12772 published in the netherlands philips semiconductors SA56202 one-chip motor driver 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 6 7.1 spindle motor control . . . . . . . . . . . . . . . . . . . . 6 7.2 internal regeneration of back-emf spindle motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7.3 sine generation using 3-phase pwm signals . . 8 7.4 programming r lim . . . . . . . . . . . . . . . . . . . . . . 9 7.5 programming r emf . . . . . . . . . . . . . . . . . . . . . 10 7.6 fg generator . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.7 sled motor driver . . . . . . . . . . . . . . . . . . . . . . 11 7.8 loading motor driver. . . . . . . . . . . . . . . . . . . . 12 7.9 actuator motor drivers . . . . . . . . . . . . . . . . . . 12 7.10 charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 12 7.11 thermal protection . . . . . . . . . . . . . . . . . . . . . 12 7.12 oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7.13 muting functions . . . . . . . . . . . . . . . . . . . . . . . 13 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 9 thermal characteristics. . . . . . . . . . . . . . . . . . 14 10 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15 11 application information. . . . . . . . . . . . . . . . . . 17 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 13 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 13.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 20 13.5 package related soldering information . . . . . . 20 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 15 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 16 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 17 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 18 contact information . . . . . . . . . . . . . . . . . . . . 23

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